1. 2. 3. material content data sheet sales product name ipd65r225c7 issued 29. august 2013 ma# MA001043904 package pg-to252-3-313 weight* 319.27 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 3.621 1.13 1.13 11340 11340 leadframe non noble metal iron 7439-89-6 0.147 0.05 461 inorganic material phosphorus 7723-14-0 0.044 0.01 138 non noble metal copper 7440-50-8 147.096 46.08 46.14 460721 461320 wire non noble metal aluminium 7429-90-5 1.892 0.59 0.59 5926 5926 encapsulation organic material carbon black 1333-86-4 1.389 0.44 4351 plastics epoxy resin - 24.309 7.61 76139 inorganic material silicondioxide 60676-86-0 113.211 35.46 43.51 354589 435079 leadfinish non noble metal tin 7440-31-5 3.740 1.17 1.17 11714 11714 plating inorganic material phosphorus 7723-14-0 0.003 0.00 11 non noble metal nickel 7440-02-0 1.421 0.44 0.44 4449 4460 solder noble metal silver 7440-22-4 0.080 0.02 250 non noble metal tin 7440-31-5 0.064 0.02 200 non noble metal lead 7439-92-1 3.055 0.96 1.00 9567 10017 heatspreader inorganic material phosphorus 7723-14-0 0.006 0.00 18 non noble metal iron 7439-89-6 0.019 0.01 60 non noble metal copper 7440-50-8 19.177 6.01 6.02 60066 60144 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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